| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit capable of forming the interval of a large gap, preferably realizing airtight sealing and preferably easily forming wiring between substrates to be bonded. SOLUTION: The integrated circuit 30 is provided with the substrate 10 with an etching surface and a non-etching surface. The etching surface is provided with circuit elements 22 and 24, and the non-etching surface is provided with a connection surface 18. The non-etching surface is arranged at a prescribed height from the etching surface. By connecting the integrated circuit 30 with the other substrate, the large gap preferably exhausted and sealed so as to be airtight is formed between the substrates. |
