Mold release film for sealing semiconductor element and sealing method for semiconductor element using it

摘要

Provided by the present invention is a mold release film for sealing a semiconductor element, which does not deform or cause deformation of the terminals of the semiconductor and which has good releasability during the semiconductor element sealing process, and a sealing method for a semiconductor element using the mold release film, which can improve efficiency of manufacturing a semiconductor. Disclosed is a mold release film for sealing a semiconductor element, comprising a single layer or a plurality of layers containing a thermoplastic resin and satisfying the following (1)-(4) requirements, and a sealing method for a semiconductor element using the mold release film: (1) a wetting index of a front surface layer of the mold release film is 36 or less; (2) a heat shrinkage rate of the mold release film at 175C. is less than 3 percent; (3) a modulus of elasticity of the mold release film at 175C. is in the range of 10-500 MPa; and (4) a thickness of the mold release film is in the range of 10-300 mum.