| 摘要 |
The present invention provides a circuit board, which can reduce a conduction loss and generate no trouble in electric/electronic apparatuses in the case of being mounted to electric/electronic apparatuses adapting a high frequency current.A circuit board 1 is formed a manner that a copper foil layer 2 and a copper layer 3 are laminated on a base material 5 made of polytetrafluoroethylene so as to form a predetermined circuit, and further, a tin plating layer 4 is laminated on these copper layers.
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