发明名称 Method of forming a polysilicon layer
摘要 A method of forming a polysilicon layer includes the steps of: loading a semiconductor substrate in a CVD reactor wherein a gate insulating layer is formed on the substrate; decompressing the reactor; depositing a first polysilicon layer on the substrate by flowing an SiH4 gas into the reactor; forming a plurality of Si-N bonds on the first polysilicon layer by maintaining atmospheric pressure of the reactor by filling the reactor with nitrogen gas; decompressing the reactor; and depositing a second polysilicon layer on the first polysilicon layer by flowing SiH4 gas into the reactor.
申请公布号 US6498082(B1) 申请公布日期 2002.12.24
申请号 US20000643730 申请日期 2000.08.23
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 HO WON-JOON;KIM HYUNG-SIK
分类号 H01L21/28;H01L21/31;H01L21/3205;H01L29/49;(IPC1-7):H01L21/320 主分类号 H01L21/28
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