发明名称 |
Method of forming a polysilicon layer |
摘要 |
A method of forming a polysilicon layer includes the steps of: loading a semiconductor substrate in a CVD reactor wherein a gate insulating layer is formed on the substrate; decompressing the reactor; depositing a first polysilicon layer on the substrate by flowing an SiH4 gas into the reactor; forming a plurality of Si-N bonds on the first polysilicon layer by maintaining atmospheric pressure of the reactor by filling the reactor with nitrogen gas; decompressing the reactor; and depositing a second polysilicon layer on the first polysilicon layer by flowing SiH4 gas into the reactor.
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申请公布号 |
US6498082(B1) |
申请公布日期 |
2002.12.24 |
申请号 |
US20000643730 |
申请日期 |
2000.08.23 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. |
发明人 |
HO WON-JOON;KIM HYUNG-SIK |
分类号 |
H01L21/28;H01L21/31;H01L21/3205;H01L29/49;(IPC1-7):H01L21/320 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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