Polishing slurry for the chemical-mechanical polishing of silica films containing a colloidal silica abrasive and a quaternary ammonium salt

摘要

A polishing slurry for chemical mechanical polishing that contains 5-50% by weight of a colloidal silica abrasive and 0.1-10% by weight of octyldimethylbenzyl ammonium chloride or cetyltrimethyl ammonium bromide, and optionally it may also contain hydroxides of an alkali metal such as potassium hydroxide. This polishing slurry may be suitable for polishing silica film.