METHOD FOR MOUNTING CHIP

摘要

PROBLEM TO BE SOLVED: To provide a method for mounting a chip in which stabilized electrical connection can be realized by ensuring adhesion between the conductive part of a semiconductor substrate and a bump part. SOLUTION: A method for mounting a chip comprising a step for placing a paste at a bump part 3 provided on a chip 1, and a step for disposing the chip 1 oppositely to a semiconductor substrate 6 at a specified position thereof while aligning the bump part 3 and a conductive part 5 provided on the semiconductor substrate 6 and then connecting or mounting the chip 1 is further provided with a step for roughening the surface at the bump part 3 of the chip 1 and placing the paste at the bump part 3.