发明名称 |
SUBSTRATE FOR MOUNTING WITH ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate on which electronic components are mounted, where the length of a wire is shortened and a wiring space can be enlarged. SOLUTION: The substrate on which electronic components are mounted comprises a mounting part 8 for mounting an electronic component 81, and a plurality of band-like patterns 6 and 7 provided in parallel along its periphery. At lest adjoining two band-like patterns 6 and 7 among plurality of band-like patterns comprise bonding pads 61 and 71 protruding sideways from the band- like patterns; while the bonding pad 61 of one band-like pattern 6 and the bonding pad 71 of the other band-like pattern 7 are provided in a region 1 sandwiched between the adjoining band-like patterns 6 and 7.
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申请公布号 |
JP2002368153(A) |
申请公布日期 |
2002.12.20 |
申请号 |
JP20010167178 |
申请日期 |
2001.06.01 |
申请人 |
IBIDEN CO LTD |
发明人 |
GOTO NOBUMASA;ARAI HIROYUKI |
分类号 |
H01L23/12;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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