METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board having an interlayer connection, which can correspond to high precision and micronization. SOLUTION: The method is provided with a process for preparing a laminated copper-plated board 20 having at least two or more conductive layers 1, an interlayer connecting process for piling a post-like or a bar-like conductive material 6 connecting the conductive layers by a piling device 7 in the prescribed position of the laminated copper-plated board 20 and a pressing process for flattening the laminated copper-plated board where the interlayer connecting process is completed. In the interlayer connecting process, a pulling device having a punching mechanism can perform punching work when the pulling device goes forward and it can pull up the conductive material when the device goes back or a dispenser device having a punching mechanism can perform punching work when the dispenser device goes forward and it can fill a formed hole with conductive paste when the dispenser device goes back.