| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket which can make testing or evaluation of a semi conductor package at a high-frequency region. SOLUTION: The socket for testing and evaluation of semiconductor package having a plurality of soldering balls arranged in a lattice shape is provided with a plurality of contacts arranged in a lattice shape and a socket body equipped with each contact, of which, a first contact piece 11e and a second contact piece 11f are so set not to contact each other as long as a soldering ball contact part 11c is in non-contact with a soldering ball S and a conductor pattern of a board is in non-contact with a conductor pattern contact part 11d, while they are so set as to contact each other when the soldering ball S is pressure contacted with the soldering ball contact part 11c and the conductor pattern of the board is pressure contacted with the conductor pattern contact part 11d so that the first contact piece 11e and the second contact piece 11f are displaced to get closer to each other.
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