| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where a semiconductor element is mounted at a proper position, with higher accuracy, of a substrate of a semiconductor device body. SOLUTION: A semiconductor device is provided, where a semiconductor element 2 is mounted on a circuit forming surface of a semiconductor substrate 1 where pad electrodes 5 are arranged along the periphery, and a prescribed region containing the semiconductor element 2 is resin-sealed; and index lines 3, corresponding to at least three corner positions of the semiconductor element 2 which is to be mounted, are formed on the circuit forming surface of the semiconductor substrate 1. |
