| 摘要 |
PROBLEM TO BE SOLVED: To provide a very thin copper foil which is improved in handling properties, protected against contamination caused by contaminants such as the resin powder of prepreg sheets, effectively prevented from being marked or dented by foreign objects, and protected against marks made in a usual cutting process, a packaging process, or in transit, the mixture of foreign objects, wrinkles, folds and the like. SOLUTION: A composite copper foil is equipped with a copper or a copper alloy support provided with a nickel layer which is coated with an oxide film and located between the support and a very thin copper foil, and a printed board using the composite copper foil is provided.
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