| 摘要 |
PROBLEM TO BE SOLVED: To prevent decrease in the degree of vacuum due to the gas from an adhesive and generation of contaminant by fixing a semiconductor chip and a board without using an adhesives. SOLUTION: A push-in pin 5 is inserted into through holes 7 and 8 while matching the through hole 7 of a semiconductor chip 3 and the through hole 8 of a board 2, thus fixing the board 2 onto a board holder 4. The push-in pin 6 is inserted into through holes 9 and 10 while matching the through hole 9 of the substrate 2 and the through hole 10 of the holder 4, thus fixing the semiconductor chip 3 on the board 2.
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