STACKED PACKAGE STRUCTURE FOR IMAGE SENSOR

摘要

PROBLEM TO BE SOLVED: To provide a stacked package structure for an image sensor. SOLUTION: The stacked package structure for the image sensor to be electrically connected to a printed circuit board has a printed circuit board, an integrated circuit and an image sensing chip. The board has a 1st side on which a signal input terminal is formed and a 2nd side on which a signal input terminal and a signal output terminal are formed, and is connected electrically to the printed circuit board. The image sensing chip is electrically connected to the signal input terminal that is placed on the integrated circuit and formed on the board. The integrated circuit is electrically connected to the signal output terminal placed on the 2nd side of the board and formed on the 2nd side of the board. Then a transparent layer covers the image sensing chip, which receives an image signal via the transparent layer and converts the signal into an electric signal transmitted to the board.