| 摘要 |
PROBLEM TO BE SOLVED: To prevent improper wire flow due to change in the flow speed of resin by making distribution of pellets equal in two multiple connected wiring boards in a resin seal forming process. SOLUTION: The manufacturing method of BGA/IC includes a pellet bonding process for bonding a plurality of pellets 3 to a plurality of unit wiring boards 11 of a multiple connected wiring board 10, a process for allowing each pellet 3 and an internal terminal 14 of the unit wiring board 11 to be subjected to wire bonding, a resin seal forming process for allowing a resin seal 60 for sealing the pellets 3 by resin to be subjected to transfer molding, and a resin seal cutting process for cutting the multiple connected wiring board 10 and resin seal 60 for each unit wiring board 11. In this case, when the pellet 3 is bonded to a failed unit wiring board 11 in the multiple connected wiring board 10 in the pellet bonding process, the pellet is reversed 180 degrees for bonding. |
