发明名称 SINGLE COMPONENT ROOM TEMPERATURE STABLE HEAT-CURABLE ACRYLATE RESIN ADHESIVE
摘要 <p>A single component liquid heat-curable adhesive formulation that is stable at room temperature. The formulation includes from about 5 to about 70 wt% of at least one acrylate monomer, from about 5 to about 94 wt% of an acrylate oligomer, and from about 0.1 to about 10 wt% of a thermal initiator selected from the group consisting of diacyl peroxides, benzoyl peroxides and peroxy esters. A photo initiator may be included thereby rendering the stable liquid formulation to be both heat-curable and UV-curable.</p>
申请公布号 WO2002100966(A1) 申请公布日期 2002.12.19
申请号 US2002003475 申请日期 2002.02.05
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