A SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DEVICE THEREON

摘要

A substrate (16) for mounting a semiconductor chip thereon. The substrate (16) comprises a first portion adapted to have a semiconductor chip attached thereto and a mold gate portion (7), the mold gate portion (7) has a surface layer with a surface tension energy which is higher than the surface tension energy of the surface of the substrate adjacent to the mold gate portion (7), and wherein the surface layer has an edge (8) nearest to the first portion which is not linear.