发明名称 Strip conductor arrangement used in integrated circuits comprises first insulating layer, second insulating layer, third insulating layer, strip conductors, electrical contact electrically coupling strip conductors in first and third layers
摘要 A strip conductor arrangement comprises a first layer (101) made from a first insulating material; a second layer (106) made from a second insulating material arranged on the first layer; a third layer (108) made from a third insulating material arranged on the second layer; a strip conductor integrated in the first layer and a strip conductor integrated in the third layer; and an electrical contact (104) electrically coupling the strip conductor in the first layer with the strip conductor in the third layer. The strip conductors and the electrical contact are made from an electrically conducting material and are surrounded by an encapsulating layer (103) made from a capsule material which is mechanically harder than the electrically conducting material. An Independent claim is also included for the production of an encapsulated strip conductor coupling. Preferred Features: The first, second and third insulating materials are mechanically softer than the electrically conducting material and are made from an organic material. The capsule material is a nitrogen compound, preferably silicon nitride, titanium nitride and/or tantalum nitride.
申请公布号 DE10127934(A1) 申请公布日期 2002.12.19
申请号 DE2001127934 申请日期 2001.06.08
申请人 INFINEON TECHNOLOGIES AG 发明人 SCHINDLER, GUENTHER;ENGELHARDT, MANFRED
分类号 H01L21/768;H01L23/532;(IPC1-7):H01L23/522 主分类号 H01L21/768
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