| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part packaging molded product which is composed of a rubber modified styrenic resin composition and excels in transparency and impact resistance. SOLUTION: The electronic part packaging molded product is composed of a rubber modified styrenic resin composition comprising (A) 45-85 mass% rubber modified styrenic resin in which >=80 vol.% rubber-like polymeric particles to form a dispersion phase has a core/shell structure, the volume medium particle diameter (dv) of the above rubber-like polymeric particles is 0.3-1.0μm, and simultaneously the ratio (dv/dn) of the volume medium particle diameter (dv) to the number medium particle diameter (dn) of <=1.5 and (B) 15-55 mass% styrene/(meth)acrylic ester-based copolymer resin, and the relationship among the content SB of the styrenic monomer units in the styrene/(meth)acrylic ester- based copolymer resin of component (B), the reducing viscosityηB of component (B), and the reducing viscosityηA of the styrenic resin to form the continuous phase of the rubber modified styrenic resin of component (A) satisfies 57<=K<=77 in formula (1): K=SB-12.4×ηA-6.01×ηB.
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