SEMICONDUCTOR DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having a bonding pad in which contamination of a probe needle during a test is reduced and good bonding is obtained and to provide a liquid crystal display using the semiconductor device. SOLUTION: A bonding pad 300 is constituted of a transparent substrate 10, a first metallic electrode pad 20b, a first insulation protecting layer 60 and a transparent electrode 320a. The first metallic electrode pad is provided on the transparent substrate and an exposed section 20b' of the pad 20b is formed at the center of the surface of the pad. An insulation protecting layer contact hole 630 is provided on the layer 60 at the position corresponding to the section 20b' of the pad 20b. A transparent electrode layer hole section 324 is formed at the position corresponding to the hole 630 formed on the layer 60 of the electrode 320a to expose the surface of the electrode pad and gate lines or signal lines are connected to the pad 20b of the bonding pad 300.