发明名称 POSITION MEASUREMENT DEVICE FOR PAD CONDITIONER HEAD OF CMP DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a position measurement device for the pad conditioner head of a CMP(Chemical Mechanical Polishing) device capable of calibrating the position thereof so that the edge of the conditioner head can come accurately into contact with the edge of a platen. SOLUTION: This position measurement device 100 comprises a first horizontal part 101 having a reference surface 102 formed to come into contact with the outer peripheral surface of the vertically formed platen of the CMP device formed horizontally at one end thereof, a second horizontal part 103 horizontally formed above the first horizontal part 101 apart a specified distance from the first horizontal part 101 and having a reference scale 107 at a position matching when the reference surface 102 is vertically expanded, and a connection part 105 fixedly connecting the first horizontal part 101 to the second horizontal part 103.
申请公布号 JP2002361554(A) 申请公布日期 2002.12.18
申请号 JP20020078711 申请日期 2002.03.20
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 HONG YONG-SUNG
分类号 G01B5/00;B24B47/22;B24B53/00;B24B53/017;B24B53/02;B24B53/12;H01L21/304 主分类号 G01B5/00
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