发明名称 |
POSITION MEASUREMENT DEVICE FOR PAD CONDITIONER HEAD OF CMP DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a position measurement device for the pad conditioner head of a CMP(Chemical Mechanical Polishing) device capable of calibrating the position thereof so that the edge of the conditioner head can come accurately into contact with the edge of a platen. SOLUTION: This position measurement device 100 comprises a first horizontal part 101 having a reference surface 102 formed to come into contact with the outer peripheral surface of the vertically formed platen of the CMP device formed horizontally at one end thereof, a second horizontal part 103 horizontally formed above the first horizontal part 101 apart a specified distance from the first horizontal part 101 and having a reference scale 107 at a position matching when the reference surface 102 is vertically expanded, and a connection part 105 fixedly connecting the first horizontal part 101 to the second horizontal part 103. |
申请公布号 |
JP2002361554(A) |
申请公布日期 |
2002.12.18 |
申请号 |
JP20020078711 |
申请日期 |
2002.03.20 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
HONG YONG-SUNG |
分类号 |
G01B5/00;B24B47/22;B24B53/00;B24B53/017;B24B53/02;B24B53/12;H01L21/304 |
主分类号 |
G01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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