发明名称 PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To dispense with the exchange of attachment of an electroless plated non-conductor by suppressing the formation of plating on a coated tool used in a electroless plating process for an engineering plastic or the like. SOLUTION: A catalyst adsorbed on the surface of the coated tool in a catalyst applying process is removed or inactivated by passing through a catalyst removing process including an oxidizing agent or a reducing agent. Because the catalyst adsorbed on the tool is removed or inactivated, the deposition of plating on the surface of the tool does not occur in the electroless plating method.
申请公布号 JP2002363761(A) 申请公布日期 2002.12.18
申请号 JP20010212863 申请日期 2001.06.07
申请人 TORIYAMA NAOKI;SONE TOMOTAKA 发明人 TORIYAMA NAOKI
分类号 C23C18/16;C23C18/20;C23C18/22;C23C18/31;(IPC1-7):C23C18/16 主分类号 C23C18/16
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