| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive adhesive which can connect without fail so as to ensure the electric conductivity of an objected to be connected without causing defective soldering or the rupture of an electronic elements, etc., around soldering. SOLUTION: This conductive adhesive is prepared by mixing an insulating adhesive as an adhesive material, a conductive resin functioning as a conductive filler, and auxiliary materials such as a curing agent. The conductive resin comprises a conductive polymer. For example, about 70 wt.% conductive polymer, about 30 wt.% insulating adhesive, and less than 1 wt.% auxiliary materials are mixed. This adhesive is used for electrically connecting a lead 11a of an electronic element 11 to a core wire 12a of a conductive wire 12 for wiring or is used for electrically connecting the lead 11a or a core wire 12a to a conductive pad 14.
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