| 摘要 |
PROBLEM TO BE SOLVED: To provide a cushioning body which integrally packs a plurality of glass substrates to form an electronic part or the like, does not require a dummy substrate, and is suitable for the packing work in a clean room, especially for the automation, and of which the reuse is possible. SOLUTION: An internal die molded body of a polyolefin resin expanded particle having specified physical properties is used. Then, on both side ends of a main body 2 of which the cross section is an L-shape, a side wall 4 which extends to the total length of the L-shape is formed.
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