| 摘要 |
A tape carrier package that is capable of preventing a short between adjacent pads in boning the tape carrier package mounted with an integrated circuit onto a liquid crystal panel and a print wiring substrate. In the package, a base film is mounted with an integrated circuit. Input pads are connected to the integrated circuit to input an external input signal to the integrated circuit. Each of output pads has a first portion extended to the integrated circuit, and a second portion extended to the first portion to have a narrower line width than the first portion.
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