| 摘要 |
PURPOSE: An apparatus for removing molding resin on a packaged semiconductor or electronic parts is provided to reduce an interval of time for eliminating molding resin and to precisely remove the molding resin, by using a milling apparatus and by performing a wet etch process using a tube for injecting etchant. CONSTITUTION: A supporting unit(10) fixes the packaged semiconductor or electronic parts. A camera(30) takes a picture of the packaged semiconductor or electronic parts and shows the surface of the packaged semiconductor or electronic parts to an operator. A milling unit(20) mechanically eliminates the surface molding resin. A wet etching unit chemically removes the surface molding resin. An etchant supply unit supplies etchant to the wet etching unit, connected to an end surface of the wet etching unit. A cleaning unit cleans the packaged semiconductor or electronic parts polished and wet-etched by the milling unit or the wet etching unit. A transfer unit makes the supporting unit move three-dimensionally, connected to an end surface of the supporting unit. The transfer unit makes the supporting unit transfer to the camera, the milling unit, the wet etching unit or the cleaning unit and performs a predetermined operation in the camera, the milling unit, the wet etching unit or the cleaning unit.
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