HIGH POWER SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A high power semiconductor chip package is provided to improve reliability, by preventing a crack of a thermal interface material itself or a chip crack even when the thermal interface material of a rigid type is used. CONSTITUTION: A semiconductor chip(20) is flip-chip bonded to a printed circuit board(PCB). A heat spreader(40) is attached to the rear surface of the semiconductor chip by interposing the thermal interface material(50) of a predetermined thickness. An encapsulating part encapsulates the semiconductor chip and its junction part is formed between the PCB and the heat spreader.