| 摘要 |
PURPOSE: A method for fabricating a wafer level package is provided to eliminate the need to perform a sputtering process for forming a metal interconnection, by fabricating the metal interconnection by a stencil print method. CONSTITUTION: A semiconductor chip(200) of a wafer level is prepared on which a plurality of chip pads(202) are formed. The first insulation layer having the first opening(214) exposing the chip pad is formed on the semiconductor chip. A stencil mask having the second opening exposing the first opening is formed. The metal interconnection(210) is formed to cover the second opening by a stencil print method using the stencil mask. The second insulation layer having the third opening exposing a ball land region(211) of the metal interconnection is formed on the first insulation layer. Conductive balls(220) are settled in the ball land region.
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