| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where electric connection can be easily materialized with high reliability, its manufacturing method, a circuit board, and an electronic apparatus. SOLUTION: The manufacturing method for a semiconductor device includes a process of forming a through hole 50 in a semiconductor chip 10 having an electrode 14, and forming a conductive layer 70 in a region including the inside of the through hole 50. For the through hole 50, the middle is made larger than the brim of its opening, and the conductive layer 70 is made by applying liquid containing metallic fine particles by ink jet method. |
