| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for processing a substrate in which a highly accurate fine resist pattern can be obtained without using any special apparatus. SOLUTION: In order to form a wiring pattern of thin metal film on a substrate W, a resist film is applied, at first, to the substrate W where a thin metal film is formed over the entire surface region. A wiring pattern is then exposed for the resist film on the surface of the substrate W. Subsequently, the substrate W is subjected to post-exposure baking and coated with developer. The developed substrate W is cleaned. Thereafter, resist etching is performed by supplying ozone water to the substrate W and etching is executed following to post-baking. |
