| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering device which can shorten the maintenance time, realize high productivity, reduce production of particles by suppress film peeling, and improve the yield. SOLUTION: This sputtering device comprises a vessel 11, a target 16, a substrate holder 41, a gas feed mechanism 25, a high frequency supply mechanism 18 for supplying the high frequency to the target, and an electrostatic attraction mechanism for fixing a substrate 42. In addition, a chamber shield 34 fitted to a side wall part via an intermediate adapter 31 is provided in the vessel 11 provided with a temperature adjusting device including a top part 12 and a cylindrical side wall part 13 as characteristic parts, and realizing the cooling effect or heating effect.
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