| 摘要 |
PROBLEM TO BE SOLVED: To improve heat sink properties of a semiconductor element and to enhance reliability of a temperature cycle by reducing a heating amount of the element by decreasing an inductance of a DC circuit. SOLUTION: A semiconductor device comprises a positive electrode circuit board 3, a negative electrode circuit board 2, output circuit boards 4, 5 and 6, the semiconductor switch element, and a buffer material of a conductor. A bridge circuit is constituted by pressure sandwiching the semiconductor switch element and the buffer material between the output circuit board and the positive electrode circuit board, and between the output circuit board and the negative electrode circuit board in such a manner that the positive electrode circuit board, the negative circuit board or the output circuit boards are used as one support of a pressurizing structure. |
