| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve heat sink properties of a semiconductor chip by preventing a crack of the chip occurring from a thermal deformation difference of a conductive plate and the chip electrically connected by a connecting member. SOLUTION: A semiconductor device has a lead electrode which communicates with a lead, a case electrode having a protrusion on a periphery, the semiconductor chip electrically connecting the lead electrode to the case electrode via the connecting member and having a rectifying function, and the conductive plate disposed between the chip and the lead electrode.</p> |
