发明名称 CURABLE AND PEELABLE SILICONE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an addition-reaction type, solventless, curable and peelable silicone composition having excellent cuing properties for providing a peelable cured film that has excellent slipperiness, and a high peeling rate dependency, wherein the peeling resistance is small at a low peeling velocity and large at a high peeling velocity. SOLUTION: This curable silicone peeling agent composition comprises (A) a diorganopolysiloxane that is represented by the formula: R<1> a R(3-a) SiO(R2 SiO)m SiR(3-b) R<1> b , has a viscosity at 25 deg.C of 50-500 mPa.s, and has 1.3-1.9 alkenyl groups bonded to a silicon atom at a molecular chain terminal, (B) a straight- chain or branched-chain organopolysiloxane represented by the formula: (R<2> R2 SiO1/2 )2 (R<3> R2 SiO1/2 )c (R2 SiO)n (RSiO3/2 )c , (C) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule, and (D) a catalytic amount of a platinum group metallic catalyst.
申请公布号 JP2002356667(A) 申请公布日期 2002.12.13
申请号 JP20010164414 申请日期 2001.05.31
申请人 SHIN ETSU CHEM CO LTD 发明人 ITO HIDEYUKI
分类号 C09K3/00;C08K3/24;C08L83/07;C09D183/04;C09D183/05;C09D183/07;(IPC1-7):C09K3/00 主分类号 C09K3/00
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