发明名称 LOW-DIELECTRIC ELECTRONIC MATERIAL AND RESIN COMPOSITION FOR THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a low-dielectric electronic material having an excellent low-dielectric property with processability required for an electronic material, a sheet and laminated board composed of the material, and a production method of a polyarylate having the low-dielectric property used as the material. SOLUTION: The low-dielectric electronic material comprises the polyarylate which consists of a residue of a dicarboxylic acid such as isophthalic acid and a residue of a dihydric phenol having a fluorene structure without having a bisphenol structure and/or an alkyl group and has a dielectric coefficient of below 2.0×10<-3> at 1 GHz. The production method of the same, a resin composition for an electronic material comprising the polyarylate and a thermosetting resin such as an epoxy resin with a compound having an active ester group as a curing agent, the low-dielectric electric materials comprising these resin compositions for an electric material and the sheet and laminated board comprising these low-dielectric electronic materials, are provided.
申请公布号 JP2002356544(A) 申请公布日期 2002.12.13
申请号 JP20010274938 申请日期 2001.09.11
申请人 DAINIPPON INK & CHEM INC 发明人 DEMURA SATOSHI;KUWANA YASUHIRO;YAMADA MASAO;SANTO YOSHINARI;USAMI SUKEAKI
分类号 C08J5/18;C08G63/193;C08G63/90;C08L67/03;C08L101/00;H01B3/40;H01B3/42;H05K1/03;(IPC1-7):C08G63/193 主分类号 C08J5/18
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