| 摘要 |
PROBLEM TO BE SOLVED: To enhance quality of forming a film on wafers by preventing oxidation and contamination of the wafers, without having to install a stand-by chamber and to reduce product cost, by reducing process time of the wafers in a vertical diffusion/CVD apparatus. SOLUTION: In a vertical diffusion/CVD apparatus, in which wafers 10 held in a boat 9 are inserted to and drawn out from the vertical furnace by a boat elevator 6 installed in the lower part of the vertical furnace, the insertion speed of the boat is kept at a speed in the range of 400 to 2,000 mm/min and the wafer temperature at the completion of the wafer insertion is set lower than 400 deg.C.
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