发明名称 MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a means whereby the generation of the warpage of a ceramic laminated electronic component is made hard irrespective of multilayer and thinning of a ceramic green sheet, in the manufacture of such a ceramic laminated electronic component as a ceramic laminated capacitor wherein the increase of its capacity and the decreases of its size and thickness are required. SOLUTION: By so creating first and second laminated blocks 10, 20 independently of each other as to be laminated, there are reduced the unevennesses of the filling densities, etc., of the respective blocks 10, 20 which are caused by the process hysteresises of their laminated hierarchies. By coupling to each other the first and second blocks, the density differences, etc., present in the respective laminated hierarchies are so reduced or so cancelled as to make hard the generations of the warpage, etc., of a final product. In the creating process of the first laminated block, via holes 2 of a green sheet 1 to become a first base portion and via holes 4 of a plurality of laminated green sheets 5 are so formed into coupling via holes by laminating the green sheets as to form via electrodes 8 collectively by filling conductive paste into the coupling via holes.
申请公布号 JP2002359149(A) 申请公布日期 2002.12.13
申请号 JP20010165904 申请日期 2001.05.31
申请人 NGK SPARK PLUG CO LTD 发明人 ITO JUNICHI;OTSUKA ATSUSHI;SATO MOTOHIKO;SATO MANABU
分类号 H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/30
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