发明名称 Method of manufacturing semiconductor device
摘要 A simple and easy method for exercising quality control over memory cell inter-layer dielectric film within a short period of time, using a memory array or single memory formed in the scribe area, without stressing nonvolatile semiconductor memory cells and a method of manufacturing a nonvolatile semiconductor memory device; whereby a single nonvolatile memory is formed in an area other than a chip area on a semiconductor wafer and used after completion of a wafer manufacturing process to perform an inter-layer dielectric film quality control process for evaluating the write saturation characteristic, cut out nondefective chips only, and conduct a plastic molding process, achieving an increased yield after chip cutting.
申请公布号 US2002187602(A1) 申请公布日期 2002.12.12
申请号 US20020163294 申请日期 2002.06.07
申请人 HITACHI, LTD. 发明人 MIURA AKEMI;KUME HITOSHI;NISHIMOTO TOSHIAKI
分类号 G11C29/50;H01L21/8247;(IPC1-7):H01L21/823 主分类号 G11C29/50
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