| 摘要 |
Here are disclosed an epoxy resin composition comprising, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, particularly preferred being the epoxy resin composition wherein the epoxy resin (A) contains a phosphorus atom, the phenolic curing agent (B) contains a nitrogen atom, and the phenoxy resin (C) contains a bisphenol S skeleton and a biphenyl skeleton, an adhesive film formed by coating the above epoxy resin composition of the present invention on a supporting base film, and a prepreg obtainable by coating and/or impregnating a sheet-shape reinforced base material made of a fiber with the resin composition, as well as a multilayer printed-wiring board made by using them and a process for manufacturing the same, whereby the object may be realized of providing an epoxy resin composition which enables to form a conductor layer excellent in adhesiveness without requiring, in the insulating layer, a roughening component which deteriorates performance, as well as a multilayer printed-wiring board using it and a process for manufacturing the same, in a multilayer printed-wiring board of a build-up type which is formed by stacking alternately conductor circuitry layers and insulating layers.
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