METHOD FOR FUSING LEAD OF SMD PACKAGE

摘要

PURPOSE: A method for fusing a lead of an SMD(Surface Mount Device) package is provided to prevent a leakage due to mis-alignment by aligning a lead and a package body with a vision system and fixing the lead and the package with a spot welding method. CONSTITUTION: A package body(25) is arranged on a loading portion of a holder to direct a lead alignment side to an upper portion. The holder is formed with non-magnetic material instead of a graphite material. The holder has a plurality of loading portions. A lead(20) is aligned on the lead alignment side of the package body(25) by using a vision system. The lead(20) and the package body(25) are fixed by performing a welding process. Both sides of the lead(20) are welded by using a spot welding electrode. The aligned lead(20) and the package body(25) are fixed by welding both sides of the lead(20). The package body(25) is arranged on the loading portion of the graphite jig(46). The package body(25) is pressed by a pressing device(30).