发明名称 |
Circuit encapsulation technique utilizing electroplating |
摘要 |
A novel technology is provided for encapsulating electronics for use in harsh media applications, such as biomedical implants. The present invention includes electroplating a metal film on top of an insulating layer to hermetically seal an electronic system, microstructure, or micro device. |
申请公布号 |
US2002185712(A1) |
申请公布日期 |
2002.12.12 |
申请号 |
US20020163292 |
申请日期 |
2002.06.05 |
申请人 |
STARK BRIAN;NAJAFI KHALIL |
发明人 |
STARK BRIAN;NAJAFI KHALIL |
分类号 |
B81B7/00;H01L23/31;(IPC1-7):H01L21/476 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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