发明名称 |
HEAT SINK AND THERMAL INTERFACE HAVING SHIELDING TO ATTENUATE ELECTROMAGNETIC INTERFERENCE |
摘要 |
Heat sink and electrically non-conducting thermal interface having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The base plate is attachable to a heat-dissipating component, and may optionally include a ground contact connection for use with components that are not already grounded.
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申请公布号 |
US2002186537(A1) |
申请公布日期 |
2002.12.12 |
申请号 |
US20010876573 |
申请日期 |
2001.06.07 |
申请人 |
FREULER RAYMOND G.;FLYNN GARY E. |
发明人 |
FREULER RAYMOND G.;FLYNN GARY E. |
分类号 |
H01L23/373;H01L23/552;H05K7/20;H05K9/00;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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