| 摘要 |
<p>A dual curable encapsulant (54) is provided for use in protecting electrical components (40, 38). The encapsulant (54) contains from about 5 to about 20 percent by weight of a multifunctional epoxy material, from about 70 to about 90 percent by weight of a di-functional epoxy material, a catalytic amount of photocurative catalyst and co-catalyst, a reactive diluent and a silica-based viscosity modifier. Ink jet printer parts assembled and protected with the dual curable encapsulant (54) exhibit enhanced ink corrosion protection.</p> |
