发明名称 |
Wiring circuit board and method for producing same |
摘要 |
The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 mum in terms of ten-point mean roughness.
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申请公布号 |
US2002185303(A1) |
申请公布日期 |
2002.12.12 |
申请号 |
US20020086428 |
申请日期 |
2002.03.04 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
TAKEUCHI HIROKI;KOJIMA TOSHIFUMI;OBAYASHI KAZUSHIGE |
分类号 |
H01L21/68;H01L23/498;H05K1/18;H05K3/46;(IPC1-7):H05K3/02 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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