发明名称 APPARATUS FOR PROCESSING SUBSTRATE
摘要 PURPOSE: An apparatus for processing a substrate is provided to prevent variations of processing conditions and to easily constitute and replace an O-ring by forming the O-ring at upper end portion of a bellows. CONSTITUTION: An O-ring(400) for supplying a flexibility and for sealing the inside of a process chamber is formed at an upper end portion of a bellows(220). A hole(220a) is formed in the bellows(220). At this time, a diameter(l2) of the upper end portion for constituting the O-ring(400) is larger than a diameter(l3) of the hole(220a). Preferably, a diameter(l1) of an inlet portion of the bellows(220) is about 20 millimeter, the diameter(l2) of the upper end portions inserted in the O-ring(400) is about 15 millimeter, and the diameter(l3) of the hole(220a) for inserting a susceptor is about 10 millimeter.
申请公布号 KR20020091903(A) 申请公布日期 2002.12.11
申请号 KR20010030710 申请日期 2001.06.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, JAE WAN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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