Method of arranging exposed areas including a limited number of test element group (TEG) regions on a semiconductor wafer

摘要

A method includes a first step of forming a first exposed area including only a device region on a semiconductor wafer that is repeated as needed. Next, a second step of forming a second exposed area including a portion of the device region and a Test Element Group (TEG) region on the semiconductor wafer is performed at least once. A plurality of first exposed areas and at least one second exposed area can be arranged on the semiconductor wafer at fixed pitches in the horizontal and vertical directions, even when the number of TEG regions is limited.