| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in the manufacture of a semiconductor device in small amount of production of multiple types of devices that an operation coefficient of an aligner is reduced and manufacturing TAT of semiconductor device increases because an exposing condition is searched for calculating the exposure energy and focus compensation value using a test wafer for every reticle, exposing process and exposing apparatus in the exposing process when manufacturing semiconductor device. SOLUTION: In an exposure processing of semiconductor devices, average exposure conditions for each process, reticle individual difference compensation coefficient, aligner difference compensation coefficient and process-originating aligner difference compensation coefficient are calculated from the past exposure conditions, reticle circuit pattern information, the aligner difference information and semiconductor device specifications information, the exposing condition is calculated from the arithmetic processes of these coefficients and the exposure process is executed using such exposure conditions. As a result, since the fluctuations of photoresist size in the exposure process can be reduced, the manufacturing yield of semiconductor device is improved.
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