| 摘要 |
PURPOSE: A consecutive processing system for manufacturing a semiconductor device is provided to prevent the contamination of a wafer by consecutively carrying out processes without exposing the wafer to the air. CONSTITUTION: A process chamber(10) is provided with the first and second process tubes(11,12), and heat buffering tube(13) located between the first and second process tubes(11,12). A load-lock chamber(20) divided into the first, second and third rooms(21,22,23) is installed on the lower portion of the process chamber(10). At this time, the load-lock chamber(20) is sealed up against the outer portion. A cassette chamber(30) is installed at one side of the load-lock chamber(20), wherein the cassette chamber(30) has a main door(32) for leading a cassette in or taking the cassette out of the cassette chamber(30). The first, second and third doors(33,34,35) are installed in the load-lock chamber(20) for sealing up each room, while selectively opening the rooms. A transfer part(40) is located in the cassette chamber(30) for transferring wafers to tube transfer pedestals(24) of the first, second and third rooms(21,22,23).
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