发明名称 METHOD FOR REMOVING LIQUID BY-PRODUCT IN POLYIMIDE CURING PROCESS
摘要 PURPOSE: A method for removing liquid by-product in a polyimide curing process is provided to be capable of preventing the contamination of a chamber and increasing preventive maintenance cycle by controlling the rising and falling rate of the temperature of the chamber. CONSTITUTION: The temperature of a chamber is increased from room temperature to about 380-420 °C at the rising rate of 6-8 °C per a minute after carrying out a curing process. Then, the temperature of the chamber is increased to 780-820 °C while decreasing the rising rate to 3-5 °C per a minute for preventing abrupt combustion. An ashing process is carried out at the temperature of 780-820 °C. Then, the temperature of the chamber is decreased to about 380-420 °C at the falling rate of 3-5 °C per a minute. The temperature of the chamber is then decreased to 200 °C at the falling rate of 6-8 °C using a fan.
申请公布号 KR100365417(B1) 申请公布日期 2002.12.06
申请号 KR19950018608 申请日期 1995.06.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 CHO, GUK HYEON
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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