| 摘要 |
<p>PROBLEM TO BE SOLVED: To speed up a critical path and to improve operating speed of a semiconductor integrated circuit apparatus by reducing the ratio of delay time caused from a wiring resistance, which the critical path occupies, of a semiconductor integrated circuit. SOLUTION: In a semiconductor integrated circuit apparatus, which comprises a driver circuit 100, a first long line 104 connected to the driver circuit 100, and a plurality of gate circuits 103 that are distributed and connected over the first long line 104, and where an output signal of the driver circuit 100 is received by the plurality of gate circuits 103 via the first line 104, an input terminal of the driver circuit 100 and a node 105 in the vicinity of an input terminal of the gate circuit 103 connected to an end of the first long line 104 are connected by a second long line 106 and a speedup circuit 107.</p> |
