| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for directly soldering a bare chip on a conductor pattern of a substrate without using heat radiation dedicated heat sink, sufficiently and surely dispersing thermal stress by resin sealing and suppressing the thermal stress for a semiconductor chip. SOLUTION: In the semiconductor device for forming a conductor pattern 3 through an insulation layer 2 on a metal substrate 1 and directly soldering a semiconductor bare chip 7 on the conductor pattern 3, the semiconductor bare chip 7 is sealed by a resin 8 having the substantially equal linear expansion coefficient as the linear expansion coefficient of the conductor pattern 3. |
